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FR4 Custom PCB Boards 4 Layer HASL High Current Power Supply UL Certificate

FR4 Custom PCB Boards 4 Layer HASL High Current Power Supply UL Certificate

  • FR4 Custom PCB Boards 4 Layer HASL High Current Power Supply UL Certificate
  • FR4 Custom PCB Boards 4 Layer HASL High Current Power Supply UL Certificate
FR4 Custom PCB Boards 4 Layer HASL High Current Power Supply UL Certificate
Product Details:
Place of Origin: China
Brand Name: SYF
Certification: ISO9001:2008, REACH, UL, SGS, RoHs
Model Number: SYF-311
Payment & Shipping Terms:
Minimum Order Quantity: 10PCS
Price: Negotiation
Packaging Details: OUTER CARDBOARD CARTON WITH INNER VACCUM-PACKED
Delivery Time: 8-10 DAYS
Payment Terms: D/P,L/C,T/T,PAYPAL,WEST UNION
Supply Ability: 1 MILLION PIECES PER MONTH
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Detailed Product Description
Solder Mask: Green/Yellow/Red/Black Materia: FR4/FR1/CEM-1/CEM-2/Metal Core
Quality: 100% E-TEST Service: PCB, PCBA, ODM, OEM
Production: Gerber File Or Design Data Needed. Surface Finish: HAL, OSP, HASL, ENIG, Immersion Tin, Immersion Silver

FR4 Custom PCB Manufacturing 4 Layer HASL PCB High Current Power Supply UL Certificate

 

Quick Details:

  1.  Digital drilling machine from Germany.
  2.  Professional PCB manufacturer.
  3.  Quality guarantee and professional after-sale service. 
  4.  Gerber file needed.
 

 PRODUCTION OF PCB PRINTED CIRCUIT BOARD

 Engineering Process

 Items

 Production Capability

 Laminate Board

 Board Thickness

 0.2~3.2mm

 Product Type

 Layers

 2L-16L

 Lamination

 Max. Panel size

 500×600mm

 Layers Inside

 Core Thickness inside

 0.1~2.0mm

 Internal Tracing

 Min: 4/4mil

 Internal Copper Thickness

 1.0~3.0oz

 Dimension Tolerance

 Board Thickness Tolerance  

 ±10%

 Inter layer Alignment

 ±3mil

 Drilling Tolerance

 Panel Measurement

 Max: 660×600mm

 Drilling Dimension

 ≧0.25mm

 Hole Diameter Tolerance

 ±0.05mm

 Hole Position Tolerance

 ±0.076mm

 Min.Annular Ring 

 0.05mm

 PTH+Panel Plating

 Hole Wall copper Thickness

 ≧20um

 Uniformity

 ≧90%

 Outer Layer

 Track Width

 Min: 0.08mm

 Track Spacing

 Min: 0.08mm

 Plating Pattern 

 Finished Copper Thickness

 1oz~2oz

 EING/Flash Gold

 Nickel Thickness

 2.5um~5.0um

 Gold Thickness

 0.03~0.05um

 Solder Mask

 Thickness

 15~35um

 Solder Mask Bridge

 3mil

 Length

 Line width/Line spacing

 6/6mil

 ENIG

 Nickel Thickness

 ≧120u〞

 Gold Thickness

 1~50u〞

 Beveling

 Beveling Dimension

 30~300mm

 Routing

 Tolerance of Dimension

 ±0.1mm

 Slot Size

 Min:0.4mm

 Cutter Diameter

 0.8~2.4mm

 Punching

 Outline Tolerance

 ±0.1mm

 Slot Size

 Min:0.5mm

 V-CUT

 V-CUT Dimension

 Min:60mm

 Angle

 15° 30° 45°

 Remain Thickness Tolerance

 ±0.1mm

 Hot Air Level

 Tin Thickness

 100~300u〞

 Test

 Testing Voltage

 250V

 Max.Dimension

 680×600mm

 Impedance Control

 Tolerance

 ±10%

 Aspect Ration

 12:1

 Laser Drilling Size

 4mil(0.1mm)

 

 Descriptions of Circuit Boards

 Basic Material

 Tg-180 FR4

 Board Thickness

 2.0 mm

 Layer Count

 4-Layer

 Copper Thickness

 1.0 oz

 Surface Finish

 LEAD FREE HASL 

 Solder Mask

 RED

 Silkscreen

 White

 Trace Spacing

 0.030/0.030mm

 Hole Size

 0.25mm

 Hole Copper Thickness

 ≥20μm

 Measurement

 64×42mm

 Packages

 Outer: Cardboard Cartons with double straps

 Inner: Vacuum-packed in soft plastic bales  

 Certification

 UL,ISO9001:2008,ROHS,REACH,SGS

 Superiority

 OEM&ODM,Competitive Price,Fast Delivery,

 Special Requirements

BGA Soldering And Gold Finger Are Acceptable 

Buried And Blind Via, Impedance Control, Via Plug,  

 Applications

 Communication,automobile,cell,computer,medical

 
 

 

Contact Details
Shenzhen YONP Power Co.,Ltd
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