FR4 Custom PCB Boards 4 Layer HASL High Current Power Supply UL Certificate

Product Details:

Payment & Shipping Terms:

Minimum Order Quantity:	10PCS
Price:	Negotiation
Packaging Details:	OUTER CARDBOARD CARTON WITH INNER VACCUM-PACKED
Delivery Time:	8-10 DAYS
Payment Terms:	D/P,L/C,T/T,PAYPAL,WEST UNION
Supply Ability:	1 MILLION PIECES PER MONTH

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Detailed Product Description

Solder Mask:	Green/Yellow/Red/Black	Materia:	FR4/FR1/CEM-1/CEM-2/Metal Core
Quality:	100% E-TEST	Service:	PCB, PCBA, ODM, OEM
Production:	Gerber File Or Design Data Needed.	Surface Finish:	HAL, OSP, HASL, ENIG, Immersion Tin, Immersion Silver

FR4 Custom PCB Manufacturing 4 Layer HASL PCB High Current Power Supply UL Certificate

Quick Details:

PRODUCTION OF PCB PRINTED CIRCUIT BOARD
Engineering Process	Items	Production Capability
Laminate Board	Board Thickness	0.2～3.2mm
Product Type	Layers	2L-16L
Lamination	Max. Panel size	500×600mm
Layers Inside	Core Thickness inside	0.1～2.0mm
	Internal Tracing	Min: 4/4mil
	Internal Copper Thickness	1.0~3.0oz
Dimension Tolerance	Board Thickness Tolerance	±10%
Dimension Tolerance	Inter layer Alignment	±3mil
Drilling Tolerance	Panel Measurement	Max: 660×600mm
	Drilling Dimension	≧0.25mm
	Hole Diameter Tolerance	±0.05mm
	Hole Position Tolerance	±0.076mm
	Min.Annular Ring	0.05mm
PTH+Panel Plating	Hole Wall copper Thickness	≧20um
PTH+Panel Plating	Uniformity	≧90%
Outer Layer	Track Width	Min: 0.08mm
Outer Layer	Track Spacing	Min: 0.08mm
Plating Pattern	Finished Copper Thickness	1oz～2oz
EING/Flash Gold	Nickel Thickness	2.5um~5.0um
EING/Flash Gold	Gold Thickness	0.03~0.05um
Solder Mask	Thickness	15～35um
Solder Mask	Solder Mask Bridge	3mil
Length	Line width/Line spacing	6/6mil
ENIG	Nickel Thickness	≧120u〞
ENIG	Gold Thickness	1～50u〞
Beveling	Beveling Dimension	30～300mm
Routing	Tolerance of Dimension	±0.1mm
	Slot Size	Min:0.4mm
	Cutter Diameter	0.8～2.4mm
Punching	Outline Tolerance	±0.1mm
Punching	Slot Size	Min:0.5mm
V-CUT	V-CUT Dimension	Min:60mm
	Angle	15° 30° 45°
	Remain Thickness Tolerance	±0.1mm
Hot Air Level	Tin Thickness	100～300u〞
Test	Testing Voltage	250V
Test	Max.Dimension	680×600mm
Impedance Control	Tolerance	±10%
Aspect Ration		12:1
Laser Drilling Size		4mil(0.1mm)

Descriptions of Circuit Boards
Basic Material	Tg-180 FR4
Board Thickness	2.0 mm
Layer Count	4-Layer
Copper Thickness	1.0 oz
Surface Finish	LEAD FREE HASL
Solder Mask	RED
Silkscreen	White
Trace Spacing	0.030/0.030mm
Hole Size	0.25mm
Hole Copper Thickness	≥20μm
Measurement	64×42mm
Packages	Outer: Cardboard Cartons with double straps Inner: Vacuum-packed in soft plastic bales
Certification	UL,ISO9001:2008,ROHS,REACH,SGS
Superiority	OEM&ODM,Competitive Price,Fast Delivery,
Special Requirements	BGA Soldering And Gold Finger Are Acceptable Buried And Blind Via, Impedance Control, Via Plug,
Applications	Communication,automobile,cell,computer,medical